Compact & Versatile SMD Stencil Printing
A compact and versatile SMD stencil printer for solder paste and grease application, designed for prototyping and small-batch production.
Combining a space-saving design with easy operation, this high-performance machine features a self-tensioning stencil frame for consistent, high-quality results with every printing cycle.
TECPRINT 500 & 700
Overview
The CIF TECPRINT is a compact manual stencil printer that allows fast and cost-effective application of solder paste or fine grease.
It is available in two sizes:
CIF TECPRINT 500: Maximum PCB size 200 × 270 mm
CIF TECPRINT 700: Maximum PCB size 300 × 400 mm
A solder paste squeegee is included as standard.
Key Benefits
Self-tensioning frame for stencils of different sizes
PCB positioning on two adjustable support bars with stops
Three pre-adjusted support pins included to prevent PCB bending
Suitable for double-sided reflow processes, with 25 mm clearance
Stencil installation in just a few seconds
Easy X, Y and theta alignment (±7.0 mm)
Supplied complete with accessories: PCB support pins and aluminium/stainless steel squeegee
Technical Specifications
Technical Specifications
Model: TECPRINT 500 / TECPRINT 700
Part Number: V900016 / V900017
Maximum Stencil Size: 210 × 320 mm / 310 × 470 mm
Minimum Stencil Size: 50 × 50 mm / 50 × 50 mm
Maximum PCB Size: 200 × 270 mm / 300 × 400 mm
Minimum PCB Size: 30 × 50 mm / 30 × 50 mm
Dimensions (L × W × H): 315 × 550 × 200 mm / 415 × 700 × 230 mm
Net Weight: 5.5 kg / 9.0 kg
Aluminium & Stainless Steel Squeegee
How It Works
