Explore our range of solder pastes for both prototyping and production applications, available in RoHS-compliant lead-free or leaded versions.

Our solutions cover Type 3 to Type 6 powder sizes and feature a no-clean flux to meet the demands of electronics professionals.

Several packaging options are available, including custom packaging tailored to your needs.

Lead-free, RoHS-compliant solder paste

• Sn96.5Ag3Cu0.5 alloy (SAC305): 96.5% tin, 3% silver, 0.5% copper
• Melting temperature (liquidus): 217 °C
• Packaging: 10 cc syringe with or without plunger, 170 cc cartridge (0.5 kg)
• No-clean flux 12 %

Also available in 250 g and 500 g jars.

• Sn62Pb36Ag2 alloy: 62% tin, 36% lead, 2% silver
• Melting temperature (liquidus): 178 °C
• Packaging: 10 cc syringe with or without plunger
• 12% no-clean flux

Ideal for rework and repair, as well as certain military and medical applications.

Also available in 250 g or 500 g jars