This compact vapour phase soldering machine is capable of soldering even the most complex PCBs, with dimensions of up to 500 × 500 × 60 mm, while ensuring excellent soldering quality thanks to:

• The inert atmosphere created by the heat transfer fluid (Galden®)

• Exceptionally uniform temperature distribution across all components

• Prevention of operator errors during the soldering cycle

• Reduced void formation

The main applications include SMD soldering of all types of PCBs, even the most complex assemblies, as well as conductive adhesive processing and rework.

The CIF VS-500 V offers:

• Reduced heat transfer fluid (Galden®) consumption thanks to a unique vapour recovery system, significantly lowering production costs

• Fast return on investment

• High capacity for mixed production

• Excellent soldering quality in an inert atmosphere

• Compensation for pressure fluctuations inside the process chamber

• Exceptionally uniform temperature distribution across the entire working area compared to other soldering technologies

• Reduced energy consumption

• Rework of electronic assemblies: desoldering and resoldering

• High reliability for all types of soldering applications

• Precision and repeatability